Construção de um reator a plasma para deposição de filmes finos com a técnica de Magnetron Sputtering

Abstract

The magnetron sputtering plasma technique is used for the deposition of coatings and thin films and is used in various industrial sectors such as automotive, food, packaging, microelectronics and etc. With this technique it is possible to deposit different materials on surfaces of polymeric, ceramic and metallic substrates. The characteristics of the films can be geared to applications in optics, electrical, sterilization and others, depending on the purpose for which they are intended. The equipment required for the application and generation of thin films is the reactor, composed of three sets: vacuum system, feed system and magnetron. This paper describes the development of a reactor and the magnetron system, including mechanical design and component manufacturing using subtractive manufacturing. For the plasma opening, a 1000 V maximum voltage AC electric source and a 10-2 mbar maximum vacuum generator mechanical pump were used. Plasma opening and chamber vacuum tests show that the system worked efficiently and without significant leaks, allowing it to reach pressures of 4.5 10-2 mbar. The deposition of 100 mA current copper films with the reactor residual gas was carried out on a coverslip substrate for microscopy at different distances from the magnetron, indicating that the distance directly influences the deposition rate of the metallic film affect issues such as uniformity and thickness of the deposited film.